Senior Expert R&D – Substrate & Packaging Industrialization

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. To enhance the successful R&D Team in Leoben, Austria, AT&S is looking for a passionate Senior Expert R&D – Substrate & Packaging Industrialization.

In this role, you will be responsible for the evaluation and transfer of integration approaches for components requiring high-precision alignment within substrate and packaging environments. The role focuses on assessing feasibility under realistic production conditions and contributes to the development and realization of integration approaches.

Your responsibilities

• Evaluate integration approaches for components requiring high-precision alignment within substrate and manufacturing environments
• Assess compatibility of proposed approaches with existing process capabilities, materials, and infrastructure
• Contribute to the development and realization of integration approaches within prototyping and process development activities
• Identify process limitations, critical tolerances, and integration constraints affecting implementation
• Support and execute experimental work, including design of experiments (DoE), to validate approaches under realistic conditions
• Identify and understand process sensitivities and critical parameters affecting stability and yield
• Iteratively refine processes based on experimental results and learnings
• Contribute to the identification of required process adaptations, capability gaps, and infrastructure needs
• Support internal decision-making by providing feasibility assessments and technical input
• Contribute to definition of implementation pathways for new technologies

Your profile

• Bachelor’s or Master’s degree in Engineering, Materials Science, Electronics, or a related technical field
• Several years, typically 5+ years, of experience in substrate, PCB, or advanced packaging manufacturing or process development environments
• Experience working across R&D, engineering, experimental work and design of experiments (DoE), and production interfaces in a collaborative environment
• Experience in IC substrate manufacturing, HDI technologies, integration or prototyping is an advantage
• Strong understanding of manufacturing and assembly processes in substrate or packaging environments
• Ability to translate technical concepts into feasible and stable process solutions under real production conditions
• Understanding of process sensitivities, tolerances, and material interactions in high-precision assemblies
• Structured, hands-on, and solution-oriented way of working with a focus on implementation
• Fluency in English

Our Offer

• A meaningful role with opportunities for long-term growth in an international environment
• Chance to actively contribute to AT&S’ success and to create value
• A structured and tailor-made onboarding program along with continual training opportunities
• Modern company canteen with freshly prepared meals every day
• Free parking spaces and e-charging stations
• Diverse health measures and a wide range of employee benefits

AT&S is an equal opportunity employer. The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry, employment group H, with competitive salaries and additional benefits based on performance, experience and qualification.